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NXP i.MX8M Plus Embedded Development Kit For AI Machine Learning IAC-IMX8MP-Kit

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$249.00

CPU: NXP i.MX8M Plus
  • Quad ARM® Cortex™-A53 cores @ 1.6 GHz
  • Single ARM® Cortex-M7 core @ 800 MHz
NPU: 2.3 TOPS
GPU: GC7000UL
  • Supports OpenCL and Vulkan
  • 16 GFLOPS
  • OpenGL ES 3.0/3.1, Vulkan, OpenCL 1.2 FP, OpenVG 1.1
VPU:
  • Supports 1080p60 H.265/4, VP8, VP9 video decoding
  • Supports 1080p60 H.265/4 video encoding
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SKU: IAC-IMX8MP-Kit
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Product details

 

NXP i.MX8M Plus Embedded Development Kit

 

Empower Edge Machine Learning

 

NXP i.MX8M Plus Embedded Development Kit For AI Machine Learning

 

The IAC-IMX8MP-KIT embedded development board is powered by the NXP i.MX 8M Plus series processor, offering a robust platform for edge intelligence, AI, and machine learning (ML). Key features include:

  • CPU:
    • Quad ARM® Cortex-A53 cores @ 1.6 GHz
    • Single ARM® Cortex-M7 core @ 800 MHz
  • NPU:
    • Integrated Neural Processing Unit (NPU) with up to 2.3 TOPS, enabling efficient and powerful machine learning inference at the edge.
  • GPU:
    • GC7000UL with support for OpenCL, Vulkan, OpenGL ES 3.0/3.1, and OpenVG 1.1, providing high-precision graphics processing.
  • ISP:
    • Built-in Image Signal Processor (ISP) for advanced image processing, supporting high dynamic range (HDR) and other complex image tasks.
  • Multimedia:
    • Advanced multimedia capabilities, including support for 1080p60 H.265/4, VP8, and VP9 video decoding and encoding.
  • Connectivity and Interfaces:
    • Dual Gigabit Ethernet
    • USB 3.0
    • USB Type-C
    • M.2 slots for SSD and 4G/5G modules
    • CAN-FD
    • Onboard Wi-Fi/Bluetooth module
    • RS232
    • RS485
    • I2C
    • GPIO
  • Reliability and Protection:
    • ECC protection for internal memory and DDR interface
    • Industrial-grade temperature range from -40°C to +85°C, ensuring reliability in harsh environments.
  • Development and Applications:
    • The development kit expedites the development of IoT, vision systems, smart city, smart home, and smart medical applications.
    • It meets the stringent requirements of industrial applications and reliability tests.

This comprehensive development board provides a versatile and powerful platform for a wide range of applications, making it an ideal choice for developers and engineers working on cutting-edge projects.

 

High Performance, Multi-Core Processor

The processor adopts advanced 14nm LPC FinFET technology to enhance performance while optimizing power consumption. It features a quad-core Cortex-A53 CPU running at up to 1.6 GHz, providing high computational power for general-purpose tasks, and a single-core Cortex-M7 CPU running at 800 MHz, designed to handle real-time operations and embedded control tasks efficiently. This combination ensures both high performance and efficient power management, making it ideal for demanding applications.

 

 

 

Machine Learning & Vision

The NXP i.MX8M Plus Embedded Development Kit For AI Machine Learning is equipped with a built-in neural processing unit (NPU) that accelerates machine learning tasks, delivering up to 2.3 TOPS (Tera Operations Per Second). This NPU enables local edge processing of machine learning and inference, with a processing speed that is 30 times faster than the ARM core. It supports a wide range of applications, including object classification, object detection, object recognition, and scene parsing.

The NPU supports mainstream AI frameworks such as TensorFlow Lite, ArmNN, OpenCV, and Caffe. This support allows for the rapid embedding of AI models into the hardware platform, making it versatile for various application scenarios and deep learning models.

 

Embedded Development Kit For AI Machine Learning

 

 

Dual Image Signal Processor (ISP)

The NXP i.MX8M Plus Embedded Development Kit For AI Machine Learning is integrated with dual ISPs, capable of handling an input rate of up to 375 MPixel/s, which supports dual camera inputs. These ISPs are designed to handle high dynamic range (HDR) with fast multiple exposure, image enhancement, and other complex image processing tasks. This provides sensitive and robust machine vision, making it ideal for applications that require high-quality image processing and real-time analysis.

 

NXP i.MX8M Plus Embedded Development Kit

 

 

Audio and Video Integration for an Immersive Sensory Experience

 

The NXP i.MX8M Plus Embedded Development Kit For AI Machine Learning supports LVDS, MIPI-DSI, and HDMI 2.0, allowing for simultaneous access to three screens with the same or different displays. It also features a high-performance HiFi 4 DSP, six SAI channels, and supports I2S, TDM, DSD, S/PDIF, 8-channel PDM MIC input, eARC, and ASRC, providing a rich and immersive audio and voice experience.

 

Embedded Development Kit For AI

 

 

Interfaces Integration

The NXP i.MX8M Plus Embedded Development Kit For AI Machine Learning is equipped with 2-channel Gigabit Ethernet, 3-channel USB 3.0, 1-channel USB Type-C, and 2 M.2 slots for externally connecting SSD modules and 4G/5G modules. It also includes 2-channel CAN-FD high-speed communication ports to achieve high efficiency and fluent data transmission. Additionally, it features an onboard Wi-Fi module, 4-channel RS232, 1-channel RS485, MIPI-DSI, LVDS, HDMI, I2C, GPIO, and a SIM card slot. All signals on the SOM module are fully drawn out, providing strong extension capabilities to meet the diverse application requirements of different products.

 

NXP Embedded Development Kit For AI

 

i.MX8M Plus Embedded Development Kit For AI

 

 

Long Supply Longevity

 

As a Golden Partner with NXP, Qiyang ensures long-term supply longevity, providing extended support and availability for the modules. This commitment helps customers plan and manage their product lifecycles with confidence.

 

NXP i.MX8M Plus Development Kit For AI

 

 

Application Scenarios of the NXP i.MX8M Plus Embedded Development Kit

 

 

 

Optional Accessories

7 inch capacitive screen(QY-HJ070NA)
10.1 inch capacitive screen( GN101IB27811433A)
4G Module(EC25)
GPS Module(QY-GPS)

 

 

Parameters of the NXP i.MX8M Plus Embedded Development Kit

 

 

Embedded Development Kit For AI Machine Learning

 

 

 

Parameters
CPU NXP i.MX8M Plus ,Quad ARM® Cortex™-A53 + Cortex-M7 Frequency Cortex-A53@1.6 GHz, Cortex-M7@800MHz
NPU 2.3Tops GPU GC7000UL with OpenCL and Vulkan support 16 GFLOPS OpenGL ES 3.0/3.1、 Vulkan、 Open CL 1.2FP、 OpenVG1.1
VPU Support 1080p60, H.265/4, VP8, VP9 video decoding; support 1080P60, H.265/4 video codes ISP Dual Camera ISP (12MP)
RAM 2GB LPDDR4 Flash 8GB eMMC,16GB/32GB eMMC Opt.,(QSPI Flash Selectable)
Ethernet 2 * Gbit/s Ethernet (1x TSN) UART 1 * Cortex-A53 Debug UART; 1 * Cortex-M7 Debug UART;4 x RS232(3 * 3-wire RS232、 1 * 5-wire RS232);1 * RS485
CAN 2 * CAN-FD Wi-Fi On board WIFI Module, support 2.4GHz/5GHz Dual -frequency wifi, 802.11a/b/g/b/ac protocol
Display Interface 1*MIPI-DSI(4-Lane),with resolution of 1920×1080@60; 1*LVDS(Dual-Channel), with resolution of 1920×1080@60; 1*HDMI(eARC),with resolution of 1920×1080@60 Audio 2*Speaker amplifier output; dual -channel audio output (Earphone socket); MIC audio input
USB 3*USB3.0 HOST; 1*USB Type-C Camera 2*MIPI-CSI(4-Lane),support two cameras simultaneous input
Input Interface I2C Extension Interface M.2 M-KEY(To connect SSD); M.2 B-KEY(To connect 5G module); SIM Card; 3*GPIO(1.8V)
Storage interface 1*TF Card Other Reserved circuit, Watchdog, Real time clock
Power Supply +12V Size Core board:60mm*63mm(8-Layer PCB); Carrier board:200mm*150mm(4-Layer PCB)
Power Consumption 5W Operating Temperature -40℃ ~ +85℃
Working Humidity 5% ~ 95%, non-condensing Operating System Linux5.10.35,Android (Unreleased)

 

 

 

Specification of the NXP i.MX8M Plus Embedded Development Kit

 

NXP i.MX8M Embedded Development Kit For AI

 

 

Specification
J2 DC+12V Power In J3 Gigabit Ethernet
J4 Gigabit Ethernet J5 Type-C
J6 USB3.0 HOST J7 USB3.0 HOST
J8 USB3.0 HOST J9 HDMI
J10 3.3V/5V Jumper J11 LVDS
J12 I2C J13 Backlight
J14 MIPI-DSI J15 MIPI-CSI
J16 MIPI-CSI J17 MIC Input
J18 Audio Output J19 Speaker
J20 Speaker J21 Wi-Fi IPEX Antenna
J22 M.2 (To connect 4G/5G Module) J23 M.2 (To connect SSD)
J24 Cortex-A53 Debug UART J25 Cortex-M7 Debug UART
J26 RS232 J27 RS232
J28 RS232 J29 RS232 (5-Wire )
J30 RS485 J31 CAN
J32 CAN J33 TF Card
J34 GPIO J37 USB Jumper
U18 Wi-Fi Module S1 SIM
BT1 RTC SW1 DIP Switch
SW2 Reset Switch SW3 ON/OFF Switch
LED3 Indicator    

 

 

 

 

Additional information

Weight 0.5 kg
Chip Manufacturer

NXP

CPU Model

i.MX8M Plus

CPU Architecture

ARM Cortex-A53, ARM Cortex-M7

GPU

GC7000UL

NPU

2.3 TOPs

Memory

2G

eMMC

8G

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