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Allwinner T113-S3 ARM System On Module SOMs MYC-YT113X

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$14.00$17.00

  • Allwinner T113-S3 Dual-core ARM Cortex-A7 MPU at 1.2GHz.
  • 128MB DDR3 and Single-core HiFi4 DSP.
  • 4GB eMMC or 256MB Nand Flash, 32KB EEPROM.
  • 1.0mm pitch, 140-pin Stamp Hole Expansion Interface.
  • Supports running Linux 5.4 OS.
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SKU: MYC-YT113X
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Product details

Measuring just 37mm by 39mm, the MYC-YT113X is a low-cost embedded ARM System On Module (SOMs) based on the Allwinner T113-S3 processor. This processor features a dual-core ARM Cortex-A7 MP-U capable of running at up to 1.2GHz, integrated with 128MB of DDR3 memory, a single-core HiFi4 DSP, and a robust video engine. The module also supports a wide range of peripherals, including Gigabit Ethernet, 2 CAN interfaces, 2 USB 2.0 ports, and 6 UARTs.

The ARM System On Module (SOMs) MYC-YT113X leverages the full capabilities of the T113-S3 processor and comes with standard configurations of either 256MB NAND Flash or 4GB eMMC for external memory options. Numerous peripheral and IO signals are accessible via a 1.0mm pitch 140-pin stamp-hole (Castellated-Hole) expansion interface. It is capable of running Linux and is suitable for applications such as HMI, industrial automation, and display and control terminals.

 

ARM System On Module MYC-YT113X

MYC-YT113X (delivered with shielding cover by default)

 

MYIR offers the MYD-YT113X Development Board for evaluating the MYC-YT113X. It fully utilizes the Allwinner T113-S3 MPU to provide a comprehensive set of peripherals and interfaces to the base board, including serial ports, one Gigabit Ethernet, two USB 2.0 HOST ports, one USB 2.0 OTG, one Micro SD card slot, and one M.2 Socket for a USB-based 4G/5G LTE module with two SIM card holders. Additionally, it features a USB 2.0 based WiFi module, a GPIO/I2C/UART/SPI/CAN extension header, audio input/output, and an LVDS display interface.

 

Allwinner T113-S3 ARM System On Module

MYD-YT113X Development Board Top-view

ARM System On Module MYC-YT113X

MYD-YT113X Development Board Bottom-view

 

MYIR also offers the MY-WIREDCOM RPI Module (RS232/RS485/CAN) and the MY-LVDS070C LCD Module as optional add-ons for the MYD-YT113X Development Board, enhancing its functionality.

 

ARM System On Module Features

Mechanical Parameters

  • Dimensions: 37mm x 39mm
  • PCB Layers: 6-layer design
  • Power supply: 5V/1A
  • Working temperature: -40~85 Celsius (industrial grade)

Processor

  • Allwinner T113-S3 processor
    – Up to 1.2GHz Dual-core Arm Cortex-A7 with built-in 128MB DDR3
    – Single-core HiFi4 DSP
    – Supports H.265/H.264 video decoding up to 1080p@60fps and JPEG/MJPEG video encoding up to 1080p@60fps

Memory

  • 4GB eMMC or 256MB Nand FLASH
  • 32KB EEPROM

Peripherals and Signals Routed to Pins

  • 1.0mm pitch 140-pin stamp hole expansion interface
    – 1 x RGMII/RMII
    – 2 x USB2.0
    – 6 x UART
    – 2 x CAN
    – 4 x TWI
    – 2 x SPI
    – 1 x GPADC and 4 x TPADC
    – 1 x MIPI DSI
    – 2 x LVDS
    – 1 x RGB
    – 1 x CVBS Out (TV Out)
    – 1 x Parallel CSI
    – 2 x CVBS In (TV In)
    – 2 x I2S
    – Up to 59 GPIOs

Note: the peripheral signals brought out to the expansion interface are listed at their maximum number. Some signals are shared. For detailed information, please refer to the processor datasheet and the CPU Module pin-out description document.

 

OS Support

  • Linux 5.4

 

ARM System On Module (SOMs) Hardware Specification

 

The ARM System On Module (SOMs) MYC-YT113X utilizes the 14 x 14mm, eLQFP128 packaged Allwinner T113-S3 processor, designed for automotive and industrial control applications. It integrates a dual-core Cortex-A7 CPU and a single-core HiFi4 DSP to deliver high-efficiency computing power. The T113-S3 supports full-format decoding, including H.265, H.264, MPEG-1/2/4, JPEG, VC1, and others. An independent hardware encoder supports JPEG or MJPEG encoding. The integration of multiple ADCs/DACs and I2S/PCM/DMIC/OWA audio interfaces enables superior voice interaction solutions. The T113-S3 also comes with extensive connectivity options to facilitate product expansion, such as CAN, USB, SDIO, EMAC, TWI, UART, SPI, PWM, GPADC, IR TX&RX, and more.

 

Features

Description

CPU

– Dual-core ARM Cortex-A7

– 32KB L1 I-cache + 32KB L1 D-cache per core, and 256KB L2 cache

 

DSP

– Single-core HiFi4

– 32KB I-cache + 32KB D-cache

 

Memory

– SIP 128MB DDR3

– SD 3.0/eMMC 5.1, SPI Nor/NAND Flash

 

Video Engine

Video decoding

– H.265 up to 1080p@60fps

– H.264 up to 1080p@60fps

– H.263, MPEG-1/2/4, JPEG, Xvid, Sorenson Spark, up to 1080p@60fps

Video encoding

– JPEG/MJPEG up to 1080p@60fps

– Supports input picture scaler up/down

 

Display Engine

– Allwinner SmartColor2.0 post processing for an excellent display experience

– Supports de-interlace (DI) up to 1080p@60fps

– Supports G2D hardware accelerator including rotate, mixer, lbc decompression

 

Video OUT

– CVBS OUT interface, supporting NTSC and PAL format

– RGB LCD output interface up to 1920 x 1080@60fps

– Dual link LVDS interface up to 1920 x 1080@60fps

– 4-lane MIPI DSI interface up to 1920 x 1080@60fps

 

Video IN

– 8-bit parallel CSI interface

– CVBS IN interface, supporting NTSC and PAL format

 

Audio

– 2 DACs and 3 ADCs

– Analog audio interfaces: MICIN3P/N, LINEINL/R, FMINL/R, HPOUTL/R

– Digital audio interfaces: 12S/PCM, DMIC, OWA

 

Security System

– AES, DES, 3DES encryption and decryption algorithms

– RSA signature verification algorithm

– MD5/SHA and HMAC tamper proofing

– Hardware random number generator

– Integrated 2Kbits OTP storage space

 

Connectivity

– USB2.0 0TG, USB2.0 Host

– SDIO 3.0, SPI x 2,UART x 6, TWI x 4, CAN x 2

– PWM (8-ch),GPADC (1-ch), TPADC (4-ch), IR TX&RX

– 10/100/1000M EMAC with RMII and RGMII interfaces

 

Package

eOFP128, 14 mm x 14 mm

Features of T113-S3 Processor

 

Allwinner T113-S3 Block Diagram

MYC-YT113X Function Block Diagram

Dimensions of MYC-YT113X

 

 

ARM System On Module (SOMs) Software Features

 

The ARM System On Module SOMs MYC-YT113X supports the Linux operating system and comes with a comprehensive software package. The kernel and numerous peripheral drivers are provided in source code form to assist clients in accelerating their development process. Below is a summary of the software features:

 

Item

Feature

Description Source Code
Bootloader U-boot Boot boot program uboot_2018.05

YES

Linux kernel Linux kernel Customized base on official kernel_5.4.61 version

YES

Device driver USB Host USB Host driver

YES

USB OTG USB OTG driver

YES

I2C I2C bus driver

YES

SPI SPI bus driver

YES

Ethernet YT8531SH driver

YES

SDHI EMMC/SD card storage driver

YES

LVDS LCD driver

YES

Touch Touch screen driver

YES

Audio SPDIF driver

YES

Watchdog Watchdog driver

YES

4G/5G 4G/5G driver

YES

PWM PWM control driver

YES

ADC ADC driver

YES

RTC RTC driver

YES

GPIO Universal GPIO driver

YES

UART RS232/RS485/TTL driver

YES

CAN CAN driver

YES

WIFI RTL8731BU driver

YES

File system t113_linux_myir_emmc_core Image built with Buildroot, excluding GUI interface

YES

t113_linux_myir_emmc_full A fully functional image built with Buildroot

YES

t113_linux_myir_nand Image built with Buildroot, excluding GUI interface, used for Nand Flash version

YES

ARM System On Module MYC-YT113X Software Features

ARM System On Module SOMs

MYD-YT113X Development Board

Allwinner ARM System On Module

ARM System On Module MYC-YT113X Top-view

Allwinner ARM System On Module SOMs

ARM System On Module MYC-YT113X Bottom-view

Additional information

Weight 0.5 kg
Chip Manufacturer

Allwinner

CPU Model

T113-S3

CPU Architecture

ARM Cortex-A7

Memory

128M

eMMC

No, 4G

EEPROM

32K

Nand Flash

No, 256M

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