Allwinner T113-S3 ARM Development Boards MYD-YT113X

The ARM Development Board MYD-YT113X comprises a compact CPU Module, the MYC-YT113X, and a base board, offering a comprehensive evaluation platform for the Allwinner T113-S3 processors. These processors feature a dual-core ARM Cortex-A7 running at up to 1.2GHz, integrated with 128MB DDR3, a single-core HiFi4 DSP, and a Video Codec Engine. The board is designed for applications such as HMI, industrial automation, and display and control terminals.

The ARM Development Board MYC-YT113X CPU Module is mounted on the MYD-YT113X base board via a 1.0mm pitch 140-pin stamp-hole (Castellated-Hole) interface. This highly integrated System-on-Module (SoM) includes the T113-S3 processor, 4GB eMMC FLASH or 256MB NAND FLASH, and 32KB EEPROM. The base board provides a rich set of peripherals through connectors and headers, including four UART ports, one Debug port, one Gigabit Ethernet, two USB 2.0 HOST ports, one USB 2.0 OTG, one Micro SD card slot, one M.2 Socket for a 4G/5G LTE Module with two SIM card holders, one WiFi module, one GPIO/I2C/UART/SPI/CAN extension header, one single-channel LVDS and one dual-channel LVDS display interface, along with an audio output interface.

MYD-YT113X Development Board Top-view

MYD-YT113X Development Board Bottom-view

The MYD-YT113X Development Board is capable of running the Linux OS. MYIR provides extensive software resources, including image files, kernel and driver source code, application demos, and compilation tools, enabling users to begin their development quickly and easily. The board comes with a Quick Start Guide, a USB to TTL serial cable, and a 12V/2A power adapter. Additionally, MYIR offers the MY-WIREDCOM RPI Module (RS232/RS485/CAN) and the MY-LVDS070C 7-inch LCD Module as optional add-ons.

Features

Mechanical Parameters

• Dimensions: 110mm x 90mm (base board), 39mm x 37mm (CPU Module)
• PCB Layers: 4-layer design (base board), 6-layer design (CPU Module)
• Power supply: 12V/2A (base board), 5V/1A (CPU Module)
• Working temperature: -40~85 Celsius (WiFi Module only supports -20~70 Celsius)

MYC-YT113X CPU Module (delivered with shieldinig cover by default)

Processor

• Allwinner T113-S3 processor
  – Up to 1.2GHz Dual-core Arm Cortex-A7 with built-in 128MB DDR3
  – Single-core HiFi4 DSP
  – Supports H.265/H.264 video decoding up to 1080p@60fps and JPEG/MJPEG video encoding up to 1080p@60fps

Memory

• 4GB eMMC or 256MB Nand FLASH
• 32KB EEPROM

Peripherals and Signals Routed to Pins

• 1.0mm pitch 140-pin stamp hole expansion interface
  – 1 x RGMII/RMII
  – 2 x USB2.0
  – 6 x UART
  – 2 x CAN
  – 4 x TWI
  – 2 x SPI
  – 1 x GPADC and 4 x TPADC
  – 1 x MIPI DSI
  – 2 x LVDS
  – 1 x RGB
  – 1 x CVBS Out (TV Out)
  – 1 x Parallel CSI
  – 2 x CVBS In (TV In)
  – 2 x I2S
  – Up to 59 GPIOs

Note: the peripheral signals brought out to the expansion interface are listed at their maximum count. Some signals are multiplexed. For detailed information, please refer to the processor datasheet and the CPU Module pin-out description document.

The MYD-YT113X Development Board Base Board

• 1 x Power Switch
• Serial ports
  – 1 x Debug UART (TTL)
  – 4 x TTL serial ports
• USB
  – 2 x USB2.0 Host ports
  – 1 x USB 2.0 OTG port (Type-C)
  – 1 x USB based WiFi Module
  – 1 x USB based M.2 socket for 4G/5G LTE Module
• 2 x SIM card slots
• Ethernet
  – 1 x 10/100/1000 Mbps Ethernet interface (RJ45)
• 1 x Micro SD card slot
• Video Output
  – 1 x Single-channel LVDS Display interface (LVDS0, 40-pin 0.5mm pitch FPC connector)
  Supports MYIR’s MY-LVDS070C LCD Module with Capacitive Touch Screen through the LCD interface
  – 1 x Dual-channel LVDS Display interface (LVDS, 30-pin 2.0mm pitch header connector)
• 1 x Audio output interface
• 1 x 2.54mm 2 x 20-pin male expansion header
  (J25, GPIO/TWI/UART, compatible with Raspberry PI standard 40-pin extension interface)Supports MYIR’s MY-WIREDCOM RPI Module to extend CAN/RS232/RS485 functions
• 2 x Buttons (one for Reset and one for User)

OS Support

• Linux 5.4

ARM Development Board Hardware Specification

The MYC-YT113X CPU Module on the MYD-YT113X ARM Development Board utilizes the 14 x 14mm, eLQFP128 packaged Allwinner T113-S3 processor, designed for automotive and industrial control applications. It integrates a dual-core Cortex-A7 CPU and a single-core HiFi4 DSP to deliver high-efficiency computing power. The T113-S3 supports full-format decoding, including H.265, H.264, MPEG-1/2/4, JPEG, VC1, and others. An independent hardware encoder supports JPEG or MJPEG encoding. The processor also features integrated multi ADCs/DACs and I2S/PCM/DMIC/OWA audio interfaces for optimal voice interaction. The T113-S3 offers extensive connectivity options for product expansion, such as CAN, USB, SDIO, EMAC, TWI, UART, SPI, PWM, GPADC, IR TX&RX, and more.

Features of T113-S3 Processor

Allwinner T113-S3 Block Diagram

MYD-YT113X Function Block Diagram

Dimensions of MYC-YT113X

ARM Development Board Software Features

The ARM Development Board MYD-YT113X supports the Linux OS and comes with a complete software package. The kernel and numerous peripheral drivers are provided in source code form to help clients accelerate their development. Below is a summary of the software features:

MYD-YT113X Development Board

ARM Development Board MYC-YT113X CPU Module Top-view

ARM Development Board MYC-YT113X CPU Module Bottom-view